XCZU29DR-1FFVF1760I
AMD XilinxZynq UltraScale+ RFSoCFPGA
Part details
- Manufacturer
- AMD Xilinx
- Part number
- XCZU29DR-1FFVF1760I
- Base device
- XCZU29DR
- Family
- Zynq UltraScale+ RFSoC
- Package
- FFVF1760
- Package type
- BGA
- Pin / ball count
- 1,760
- Speed grade
- -1
- Temperature grade
- Industrial
Device specifications
- User I/O (FFVF1760)
- 414
Part number breakdown
| Segment | Field | Meaning |
|---|---|---|
| XCZU29DR | Base Device | Zynq UltraScale+ RFSoC device XCZU29DR |
| 1 | Speed Grade | Speed grade 1 |
| FFVF1760 | Package | 1760-pin BGA (flip-chip ball grid array) |
| I | Temperature Grade | Industrial |
Related part numbers
| Part number | Relationship | Package | Speed | Temperature |
|---|---|---|---|---|
| XCZU29DR-1FFVF1760C | Same device, commercial temperature | FFVF1760 | -1 | Commercial |
| XCZU29DR-1FFVF1760E | Same device, extended temperature | FFVF1760 | -1 | Extended |
| XCZU29DR-2FFVF1760C | Same device, different speed and temperature grade | FFVF1760 | -2 | Commercial |
| XCZU29DR-2FFVF1760I | Same device, different speed grade | FFVF1760 | -2 | Industrial |
| XCZU29DR-2FFVF1760E | Same device, different speed and temperature grade | FFVF1760 | -2 | Extended |
| XCZU29DR-3FFVF1760C | Same device, different speed and temperature grade | FFVF1760 | -3 | Commercial |
| XCZU29DR-1FSVF1760I | Same device, different package | Industrial | ||
| XCZU29DR-1FSVF1760E | Same device, different package | Extended |
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