FPGA Market

XCZU27DR-2FFVG1517E

AMD XilinxZynq UltraScale+ RFSoCRFSoC

Part details

Manufacturer
AMD Xilinx
Part number
XCZU27DR-2FFVG1517E
Base device
XCZU27DR
Family
Zynq UltraScale+ RFSoC
Package
FFVG1517
Package type
BGA
Pin / ball count
1,517
Speed grade
-2
Temperature grade
Extended

Device specifications

User I/O (FFVG1517)
353

Part number breakdown

SegmentFieldMeaning
XCZU27DRBase DeviceZynq UltraScale+ RFSoC device XCZU27DR
2Speed GradeSpeed grade 2
FFVG1517Package1517-pin BGA (flip-chip ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCZU27DR-1FFVE1156CSame device, different packageFFVE1156-1Commercial
XCZU27DR-1FFVE1156ISame device, different packageFFVE1156-1Industrial
XCZU27DR-1FFVE1156ESame device, different packageFFVE1156-1Extended
XCZU27DR-2FFVE1156CSame device, different packageFFVE1156-2Commercial
XCZU27DR-2FFVE1156ISame device, different packageFFVE1156-2Industrial
XCZU27DR-2FFVE1156ESame device, different packageFFVE1156-2Extended
XCZU27DR-3FFVE1156CSame device, different packageFFVE1156-3Commercial
XCZU27DR-1FFVG1517CSame device, different speed and temperature gradeFFVG1517-1Commercial
XCZU27DR-1FFVG1517ISame device, different speed and temperature gradeFFVG1517-1Industrial
XCZU27DR-1FFVG1517ESame device, different speed gradeFFVG1517-1Extended
XCZU27DR-2FFVG1517CSame device, commercial temperatureFFVG1517-2Commercial
XCZU27DR-2FFVG1517ISame device, industrial temperatureFFVG1517-2Industrial
XCZU27DR-3FFVG1517CSame device, different speed and temperature gradeFFVG1517-3Commercial

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