FPGA Market

XCXQZU7EVFF-1RB900E

AMD XilinxZynq UltraScale+SoC FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCXQZU7EVFF-1RB900E
Base device
XCXQZU7EVFF
Family
Zynq UltraScale+
Package
RB900
Package type
BGA
Pin / ball count
900
Speed grade
-1
Temperature grade
Extended

Device specifications

User I/O (RB900)
207

Part number breakdown

SegmentFieldMeaning
XCXQZU7EVFFBase DeviceDevice XCXQZU7EVFF
1Speed GradeSpeed grade 1
RB900Package900-pin BGA (ball grid array)
ETemperature GradeExtended

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCXQZU7EVFF-1RB900CSame device, commercial temperatureRB900-1Commercial
XCXQZU7EVFF-1RB900ISame device, industrial temperatureRB900-1Industrial
XCXQZU7EVFF-2RB900CSame device, different speed and temperature gradeRB900-2Commercial
XCXQZU7EVFF-2RB900ISame device, different speed and temperature gradeRB900-2Industrial
XCXQZU7EVFF-2RB900ESame device, different speed gradeRB900-2Extended
XCXQZU7EVFF-3RB900CSame device, different speed and temperature gradeRB900-3Commercial

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