FPGA Market

XCSU35P-3SBVB625C

AMD XilinxSpartan UltraScale+FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCSU35P-3SBVB625C
Base device
XCSU35P
Family
Spartan UltraScale+
Package
SBVB625
Package type
BGA
Pin / ball count
625
Speed grade
-3
Temperature grade
Commercial

Device specifications

User I/O (SBVB625)
305

Part number breakdown

SegmentFieldMeaning
XCSU35PBase DeviceSpartan UltraScale+ device XCSU35P
3Speed GradeSpeed grade 3
SBVB625Package625-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCSU35P-1SBVB625CSame device, different speed gradeSBVB625-1Commercial
XCSU35P-1SBVB625ISame device, different speed and temperature gradeSBVB625-1Industrial
XCSU35P-1SBVB625ESame device, different speed and temperature gradeSBVB625-1Extended
XCSU35P-2SBVB625CSame device, different speed gradeSBVB625-2Commercial
XCSU35P-2SBVB625ISame device, different speed and temperature gradeSBVB625-2Industrial
XCSU35P-2SBVB625ESame device, different speed and temperature gradeSBVB625-2Extended
XCSU35P-1CMVA529ISame device, different packageIndustrial
XCSU35P-1CMVA361ESame device, different packageExtended

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