FPGA Market

XCKU9P-2FFVE900C

AMD XilinxKintex UltraScale+FPGA

Part details

Manufacturer
AMD Xilinx
Part number
XCKU9P-2FFVE900C
Base device
XCKU9P
Family
Kintex UltraScale+
Package
FFVE900
Package type
BGA
Pin / ball count
900
Speed grade
-2
Temperature grade
Commercial

Device specifications

Logic cells
599,550
Block RAM
40,900 Kb
User I/O (FFVE900)
308

Part number breakdown

SegmentFieldMeaning
XCKU9PBase DeviceKintex UltraScale+ device XCKU9P
2Speed GradeSpeed grade 2
FFVE900Package900-pin BGA (flip-chip ball grid array)
CTemperature GradeCommercial

Documentation

Related part numbers

Part numberRelationshipPackageSpeedTemperature
XCKU9P-1FFVE900CSame device, different speed gradeFFVE900-1Commercial
XCKU9P-1FFVE900ISame device, different speed and temperature gradeFFVE900-1Industrial
XCKU9P-1FFVE900ESame device, different speed and temperature gradeFFVE900-1Extended
XCKU9P-2FFVE900ISame device, industrial temperatureFFVE900-2Industrial
XCKU9P-2FFVE900ESame device, extended temperatureFFVE900-2Extended
XCKU9P-3FFVE900CSame device, different speed gradeFFVE900-3Commercial

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